Specifications
Status |
Mass Production (Preferred) |
Capacitance |
100 pF ± 5 % |
Case Size (EIA/JIS) |
008004/0201 |
Rated Voltage |
25 V |
Q (min) |
1000 |
Temperature Characteristic (EIA) |
C0G |
Operating Temp. Range (EIA) |
-55 to +125 ℃ |
Temperature Characteristic (JIS) |
CG |
Operating Temp. Range (JIS) |
-55 to +125 ℃ |
Temperature coefficient |
0 ±30 ppm/℃ |
High Temperature Loading (% Rated Voltage) |
200 % |
Insulation Resistance (min) |
10 GΩ |
Dimension L |
0.0098 ±0.0005 inch |
Dimension W |
0.0049 ±0.0005 inch |
Dimension T |
0.0049 ±0.0005 inch |
Dimension e |
0.0027 ±0.0011 inch |
RoHS Compliance (10 subst.) |
Yes |
REACH Compliance (242 subst.) |
Yes |
IEC62474 (Ver. D29.00) Compliance |
Yes |
Halogen Free |
Yes |
Soldering |
Reflow |
Standard Quantity |
Taping Embossed 50000pcs |
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Appearance
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Features
Improved higher density mounting
Monolithic structure provides higher reliability
A wide range of capacitance values available in standard case sizes
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Main Applications
General electronic equipment
Communication equipment (cellular phone, wireless applications, etc.)
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Document
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Simulation data
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Links
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RoHS and REACH Certificate of Compliance
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Characteristic value graphs
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Sn-Zn solder paste can affect MLCC reliability performance. Please contact Taiyo Yuden Co., Ltd prior to usage.
Please contact our sales staff when ordering or inquiring the details about products on our website.
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