TSB1N18D5G53LV0HBT

(Previous Part Number FI168B5538HB-T)

CERAMIC RF DEVICES

[Ceramic RF Devices (Band Pass Type)]


Appearance

Specifications

Status Mass Production (Preferred)
System Wi-Fi
Passband Frequency1 (f1) 5150 to 5925 MHz
Insertion Loss1 (max)(in f1) 1.4 dB at 5150 to 5925MHz (+25 ℃)
Insertion Loss2 (max)(in f1) 1.5 dB at 5150 to 5925MHz (-40 to +85 ℃)
VSWR1 (max)(in f1) 2 at 5150 to 5925MHz
Attenuation1 (min)(f1) 28 dB at 3300 to 4200MHz
Attenuation2 (min)(f1) 20 dB at 7200 to 7800MHz
Input Impedance / Output Impedance 50 Ω / 50 Ω
Dimension L 1.6 ±0.10 mm
Dimension W 0.8 ±0.10 mm
Dimension T Max 0.65 mm
Operating Temp. Range -40 to +85 ℃
RoHS Compliance (10 subst.) Yes
REACH Compliance (251 subst.) Yes
Halogen Free Yes
Soldering Reflow
Standard Quantity Taping Paper 5000pcs
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Features

Compact and Low-profile

Low loss and high attenuation

Stable temperature characteristics

Document

Links

RoHS and REACH Certificate of Compliance

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