(旧型号 HV-10V331MG10-R2)
铝电解电容器
[一般用导电性高分子混合铝电解电容器[HV1]]
| 供应体制 | 量产(推荐) |
|---|---|
| 静电容量 | 330 uF ± 20 % |
| 额定电压 | 10 V |
| tanδ (max) | 0.18 |
| 使用温度范围 | -55 to +105 ℃ |
| Leakage current (min) | 33 uA at 2 min |
| Rated Ripple (max) | 2500 mArms at 100k Hz / 105 ℃ |
| Impedance ratio ___[-25℃/+20℃] |
1.5 |
| Impedance ratio ___[-55℃/+20℃] |
2 |
| ESR (max) | 22 mΩ at 100k Hz / 20 ℃ |
| Endurance ___[Test time] |
5000 hr at 105 ℃ |
| Endurance ___[Capacitance change] |
Within ±30% of initial value |
| Endurance ___[tanδchange] |
200% or less of initial specified value |
| 尺寸 (φD) | φ8 ±0.5 mm |
| 尺寸 (L) | 10 ±0.5 mm |
| 尺寸 (P (F)) | Typ 3.1 mm |
| 尺寸 (C (d)) | Typ 3 mm |
| 形状 | Vertical Chip (SMD) |
| 类别 | Conductive Polymer Hybrid |
| RoHS Compliance (10 subst.) | Yes |
| REACH Compliance (242 subst.) | Yes |
| 适用焊接 方法 | Reflow |
| LeadForming/Taping | Taping Embossed |
| 包装 | 500 |